M-HP 200 Hotplate

  • Type Top Table or integrable module
  • 8” Wafer or 6”x6” Substrates
  • Heating capacity 600 Watt
  • Heating time 1-9999 sec. adjustable
  • The Hotplate is suitable for wafers up to 8“ or Substrates up to 6”x6”.
  • The integration module can easily be integrated in wetbenches or digestoriums.
  • The process parameters can be changed at any time.
  • The temperature can be adjusted between 20°C and 250°C.

Alteration right reservation to introduce improvements

Alteration right reservation to introduce improvements

  • Wafer sizes:
    Wafer up to 8″
    Substrates up to 6″x6″
  • Temperature range:
    20°C to 250°C
  • Heating capacity:
    600 Watt
  • Heating times:
    from 1 to 9999 sec (parameterised to customer needs)
  • Cover:
    High-grade steel
  • Heating area:
    Heating plate made of aluminium, anodized
  • Lift-Pins
  • Vacuum
  • Vacuum pump
  • N2-Rinsing
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